S7
Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Active Cooler for 1U Server and up, Copper Heatsink with Vapor Chamber Base, Support 205 Watts CPU Power Heat Dissipation.
Note:
Dynatron S2, S3, S4, S5, S5R1, S6, and S7 each come with the E1A and E1B Package Carrier. The E1C Package Carrier is not included but is available upon request.
Additional Information
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CPU Support |
Intel |
CPU Socket |
FCLGA 4677 |
Solution |
1U Server and Up |
Dimensions |
118.6 x 80.5 x 27.4 mm |
Weight |
424.6 g |
Material |
Copper 1100 Heatsink with Vapor Chamber Base |
Fan Dimension |
80 x 13 mm |
Speed |
At Duty Cycle 0~20%: 1900 ± 200 RPM |
Rated Voltage |
12V |
Bearing |
Double Ball |
Power |
At Duty Cycle 20%: 1.08 W |
Air Flow |
At Duty Cycle 20%: 4.0 CFM |
Noise Level |
At Duty Cycle 20%: 23.3 dBA |
Air Pressure |
At Duty Cycle 20%: 3.15 mm-H2O |
Lead Wire Pin Out |
Pin#1-Black(-) |
Thermal Grease |
Shin-Etsu 7762 Pre-printed |
*All product specifications and product images are subject to change without notice.