S4
Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Copper for both Vapor Chamber Base and Fin Stack, Passive Cooler for 1U Server and up, Support 205 Watts CPU Power Heat Dissipation.
Note:
Dynatron S2, S3, S4, S5, S5R1, S6, and S7 each come with the E1A and E1B Package Carrier. The E1C Package Carrier is not included but is available upon request.
Additional Information
Downloads
|
CPU Support |
Intel® Sapphire Rapids Processor |
|
CPU Socket |
Socket FCLGA 4677 |
|
Solution |
Blade and 1U Server |
|
Dimensions |
118 x 78 x 27 mm |
|
Weight |
437.60 g |
|
Material |
Copper Vapor Chamber and Fin Stack |
|
Thermal Grease |
Pre-Printed with SHIN-ETSU 7762 |
*Allproduct specifications and product images are subject to change withoutnotice.