S4

S4

Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Copper for both Vapor Chamber Base and Fin Stack, Passive Cooler for 1U Server and up, Support 205 Watts CPU Power Heat Dissipation.

 

Note:

Dynatron S2, S3, S4, S5, S6, and S7 each comes with E1B Package Carrier.
E1A and E1C Package Carriers are not included but they are available upon request.

 

  • Additional Information

    CPU Support

    Intel® Sapphire Rapids Processor

    CPU Socket

    Socket FCLGA 4677

    Solution

    Blade and 1U Server

    Dimensions

    118 x 78 x 27 mm

    Weight

    437.60 g

    Material

    Copper Vapor Chamber and Fin Stack

    Thermal Grease

    Pre-Printed with SHIN-ETSU 7762

    *Allproduct specifications and product images are subject to change withoutnotice.

     

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