B8
Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded for 2U server & up solution up to TDP 205 Watts heat dissipation
CPU Support
Intel
CPU Socket
LGA3647/NARROW
APPLICATION
2U
Additional Information
CPU Support Intel
CPU Socket FCLGA3647
Solution 2U Server and Up
Dimensions 108.0 x 80.0 x 64.0 mm
Weight 600 g
Material Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded
Thermal Grease Shin-Etsu 7762 Pre-Applied
*All product specifications and product images are subject to change without notice.
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