DYNATRON CORPORATION
U.S.A. HEADQUARTERS
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© 2019 by Dynatron Corporation.

B6

Copper skived fin passive heatsink for 1U server solution up to TDP 205 Watts.

CPU Support
CPU Socket
APPLICATION
  • Additional Information

    CPU Support

    Intel

    CPU Socket

    Intel Purley – EP / EX, Socket LGA 3647

    Solution

    1U Server and Up

    Dimensions

    90 x 90 x 27 mm

    Weight

    420 g

    Material

    Copper1100 Stacked Fin Heatsink with Vapor Chamber Base

    Thermal Grease

    Shin-Etsu 7762 Pre-printed

    *All product specifications and product images are subject to change without notice.

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