B6
Copper skived fin passive heatsink for 1U server solution up to TDP 205 Watts.
CPU Support
Intel
CPU Socket
LGA3647/SQUARE
APPLICATION
1U
Additional Information
CPU Support Intel
CPU Socket Intel Purley – EP / EX, Socket LGA 3647
Solution 1U Server and Up
Dimensions 90 x 90 x 27 mm
Weight 420 g
Material Copper1100 Stacked Fin Heatsink with Vapor Chamber Base
Thermal Grease Shin-Etsu 7762 Pre-printed
*All product specifications and product images are subject to change without notice.
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