Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up, Support 350W CPU powered heat dissipation.
Dynatron S2, S3, S4, S5, S6, and S7 each comes with E1B Package Carrier.
E1A and E1C Package Carriers are not included but they are available upon request.
Intel® Sapphire Rapids Processor
Socket FCLGA 4677
2U Server and up
118 x 78 x 64 mm
Copper Vapor Chamber and heat pipe, Aluminum Fin Stack
Pre-Printed with SHIN-ETSU 7762
*All product specifications and product images are subject to change without notice.