S2
Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up, Support 350W CPU powered heat dissipation.
Note:
Dynatron S2, S3, S4, S5, S5R1, S6, and S7 each come with the E1A and E1B Package Carrier. The E1C Package Carrier is not included but is available upon request.
Additional Information
Downloads
|
CPU Support |
Intel® Sapphire Rapids Processor |
|
CPU Socket |
Socket FCLGA 4677 |
|
Solution |
2U Server and up |
|
Dimensions |
118 x 78 x 64 mm |
|
Weight |
526.60 g |
|
Material |
Copper Vapor Chamber and heat pipe, Aluminum Fin Stack |
|
Thermal Grease |
Pre-Printed with SHIN-ETSU 7762 |
*All product specifications and product images are subject to change without notice.