DYNATRON CORPORATION
U.S.A. HEADQUARTERS
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© 2019 by Dynatron Corporation.

A25

Copper1100 with Skiving Fin passive heatsink for 1U server solution up to TDP 120 Watts heat dissipation

CPU Support
CPU Socket
APPLICATION
  • Additional Information

    CPU Support

    AMD EPYC

    CPU Socket

    SP3

    Solution

    1U Server and Up

    Dimensions

    113 x 77.5 x 25.5 mm

    Weight

    450 g

    Material

    Copper 1100 with Skiving Fin

    Thermal Grease

    Shin-Etsu 7762 Pre-printed

    *All product specifications and product images are subject to change without notice.

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