A25
Copper1100 with Skiving Fin passive heatsink for 1U server solution up to TDP 120 Watts heat dissipation
CPU Support
CPU Socket
APPLICATION
Additional Information
CPU Support AMD EPYC
CPU Socket SP3
Solution 1U Server and Up
Dimensions 113 x 77.5 x 25.5 mm
Weight 450 g
Material Copper 1100 with Skiving Fin
Thermal Grease Shin-Etsu 7762 Pre-printed
*All product specifications and product images are subject to change without notice.
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